Grinding Characteristics of Silicon Nitride Ceramics Using Multiple Abrasive Grains
Author:
Affiliation:

Department of Numerical Control Engineering, Baotou Iron and Steel Vocational and Technical College,Baotou 014010

Clc Number:

TG580.61

Fund Project:

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    The grinding force, temperature and ground surface topography of the grinding process were studied by combination of simulation and grinding experiment with multi-abrasive grains.The differences in grinding characteristics between models of multi-abrasive-grain and traditional single-abrasive-grain were compared and analyzed. The simulation model of multi-abrasive-grain was verified by experiment. The results showed that by reducing grinding speed or increasing grinding depth, the grinding force in simulation and experiment of both models would increase. With increase of grinding speed or grinding depth, the grinding temperature in simulation and experiment of both models would rise. In simulation of the single-abrasive-grain model, the grinding force reduced with acceleration of feed rate, with the grinding temperature falling first before going up again. However, in simulation and experiment of the multi-abrasive-grain model, the grinding force increased with acceleration of feed rate, with grinding temperature going toward the opposite trend. The grinding force and grinding temperature in the multi-abrasive-grain model were higher than those of the single-abrasive-grain. The surface morphology of the workpiece after experiment using multiple abrasive grains was consistent with simulation result. The finite element simulation model using multiple abrasive grains to grind engineering ceramics gave closer to experiment result than using single abrasive grain.

    Reference
    Related
    Cited by
Get Citation
Share
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:March 18,2021
  • Revised:May 09,2021
  • Adopted:May 10,2021
  • Online: December 23,2022
  • Published: December 30,2022