Bonding gold wires were widely used in miniaturized multichip modules of aerospace equipment. The complicate space environment required that the bonding gold wires had good bonding property and application reliability. Based on the in-depth analysis of the application requirements and typical failure modes of aerospace multichip modules， the application evaluation system of bonding alloy wires were constructed， and the usability of bonding gold wires from three aspects was comprehensively evaluated： basic material properties， process applicability and application reliability. Using the evaluation system proposed in this paper， a domestic bonding alloy wire was systematically evaluated. The data show that the basic performance indexes， bonding ability and bonding reliability of the domestic bonding gold wire are equivalent to those of the replacement imported gold wire to be replaced. In addition， the bonding strength of domestic gold wire degrades slower than that of imported gold wire at high temperature， presenting better application reliability.