C/C-SiC composite materials are widely used in the aerospace industry, where the harsh operating conditions demand high quality in secondary machining processes. Excessive grinding temperatures during machining can lead to a decrease in workpiece quality. In order to understand the influence of grinding parameters on grinding temperature of C/C-SiC composite materials, a three-factor four-level orthogonal experiment was designed to investigate the relationship between different grinding parameters and grinding temperature. The range analysis method was utilized to assess the impact of various process parameters on grinding temperature, and a comparison was made between dry grinding and minimum quantity lubrication (MQL) grinding in terms of grinding temperature.The results indicate that MQL grinding can reduce the grinding temperature and improve surface processing quality. For dry grinding, the most influential factor on grinding temperature is grinding depth, followed by grinding wheel linear velocity, with the least impact from worktable feed rate. On the other hand, in MQL grinding, the most significant factor affecting grinding temperature is the grinding wheel linear velocity, followed by grinding depth, and finally the workpiece feed rate.