CQFP packaged devices were extensively applied in various aerospace electronic units， and their soldering quality directly impacted the reliability of the entire electronic system. This paper experimentally investigated the influence of different reinforcement methods for CQFP packaged devices on solder joint reliability. The results indicate that reinforcing the four corners of CQFP devices with EC-2216 epoxy adhesive satisfies the high-reliability soldering requirements of aerospace electronic products， making this the optimal adhesive method. Reinforcement of CQFP devices solely with GD414 silicone adhesive at the four corners exhibits inferior vibration resistance； therefore， silicone adhesive must be used to fill the gap between the printed circuit board and the ceramic body bottom or edges to enhance vibration resistance. However， when silicone rubber D04 completely encapsulates and fills the gull-wing leads of CQFP devices， lead stress cannot be relieved during temperature cycling tests， resulting in solder joint micro-void aggregation and cracking， thus significantly degrading thermal fatigue resistance. Therefore， when silicone reinforcement is applied to such devices， stress-relief regions must be provided around the leads. This study offers a valuable reference for the reinforcement techniques used in aerospace electronic products utilizing CQFP packaged devices.