宇航微波组件连接技术可靠性分析
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上海航天电子技术研究所,上海 201109

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TN605

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Reliability Analysis of Aerospace Microwave Module Connection Technology
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Shanghai Aerospace Electronic Technology Institute, Shanghai 201109

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    摘要:

    针对宇航微波组件制造过程中的射频同轴电连接器与微带板之间的连接技术,以焊料硬连接、镀金铜带Ω形连接及金带包焊为研究对象,分析比较了不同连接技术的原理与特点,提出了相应的工艺控制要求与注意事项,并以SMA型电连接器为试验对象,对不同连接技术进行了鉴定试验验证、电性能测试及热应力仿真等可靠性评估与分析。结果表明:焊料硬连接焊点在经历力学鉴定试验和200次温度循环试验后出现疲劳纹,镀金铜带Ω形连接和金带包焊焊点则未出现异常;金带包焊的电性能与焊料硬连接较为接近,在1~8 GHz内基本满足使用要求,镀金铜带Ω形连接的电性能一致性较差;相同温度载荷下,硬连接焊点的最大热应力远大于镀金铜带Ω形连接及金带包焊,采用金带包焊的力学设计裕度远大于硬连接。

    Abstract:

    For the connection technologies between RF coaxial electrical connectors and microstrip circuit boards in manufacturing process of aerospace microwave components, the principles and characteristics of solder hard connection, Ω-shaped gold-plated copper band connection and gold band cladding welding were analyzed. The process control requirements and considerations of different connection technologies were proposed. The experiments, reliability evaluations and analysis of different connection technologies were carried out with electrical connectors of SMA, including qualification test, electrical properties test and thermal stress simulation. The results show that fatigue striations appear at the joints of solder hard connection after mechanical qualification test and 200 cycles of temperature cycling test, while the abnormity dose not appear in the joints of Ω-shaped gold-plated copper band connection and gold band cladding welding. The electrical properties of gold band cladding welding are similar with hard solder connection, which can meet the service demand basically in the range of 1 GHz to 8 GHz. The electrical properties of the connection of Ω-shaped gold-plated copper band have poor consistency; Maximum thermal stress of the solder joint of solder hard connection is much more than that of Ω-shaped gold-plated copper band connection and gold band cladding welding in the same temperature load, the mechanical design margin of gold-strip cladding welding is much more than that of solder hard connection.

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吴奇,温学思,许迪,金蓓蓓,王晓涵.宇航微波组件连接技术可靠性分析[J].宇航材料工艺,2021,51(Z1):92-99.

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  • 收稿日期:2021-08-11
  • 最后修改日期:2021-08-11
  • 录用日期:2021-08-26
  • 在线发布日期: 2021-09-29
  • 出版日期:
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