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基于遗传优化算法的微通道紫铜热交换器扩散连接工艺
叶建华1,陈明和1,谢兰生1,苏楠1,罗峰1
南京航空航天大学 机电学院,南京 210016
摘要:
基于遗传优化算法,进行了T2紫铜同种材料扩散连接工艺研究。采用正交试验方法,结合BP神经网络和多目标遗传算法,以扩散连接时的温度、压力、保温时间为输入变量,以扩散连接后的试样焊合率和变形量为输出变量,对扩散连接工艺参数进行优化,并实施相应的扩散连接验证试验。结果表明:T2紫铜合适的扩散连接工艺参数为:温度780 ℃、压力7.5 MPa、保温时间120 min,此条件下焊合率可达95.26%,变形量为0.166 mm。采用此工艺参数进行微通道热交换器零件制造,厚度方向变形量0.162 mm,经超声C扫描后连接情况良好,经耐压防漏检测后满足密封性及设计要求。
关键词:  微通道热交换器  T2紫铜  扩散连接  多目标遗传算法
DOI:10.12044/j.issn.1007-2330.2019.05.004
分类号:TG457.1
基金项目:
Diffusion Bonding Process of Microchannel Copper Heat Exchanger Based on Genetic Optimization Algorithm
YE Jianhua1,CHEN Minghe1,XIE Lansheng1,SU Nan1,LUO Feng1
College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016
Abstract:
Based on genetic optimization algorithm,the diffusion bonding process of T2 copper was studied. Used orthogonal test method and combined with back propagation(BP) neural network and multi-objective genetic algorithm,the temperature,pressure and holding time of the diffusion bonding are taken as input variables and the bonding rate and deformation of the sample were taken as output variables after diffusion bonding.The process parameters of diffusion bonding were optimized,and the corresponding diffusion bonding verification test was carried out.The results show that the appropriate diffusion bonding process parameters of T2 copper are:the temperature is 780 ℃,the pressure is 7.5 MPa and the holding time is 120 min. Under this condition,the bonding rate can reach 95.26% and the deformation is 0.166 mm.The above-mentioned process parameters are used to manufacture the parts of the microchannel heat exchanger,and the deformation in the thickness direction is 0.162 mm.After ultrasonic C-scanning,the bonding condition is good, and the sealing and design requirements are satisfied after the pressure-proof and leak-proof detection.
Key words:  Microchannel heat exchanger  T2 copper  Diffusion bonding  Multi-objective genetic algorithm